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XB-USA-210V2
  • XB-USA-210V2
  • XB-USA-210V2
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  • XB-USA-210V2
  • XB-USA-210V2

3D file Specifications USB2.0
DrawingsXB-SUA-210V2

Xibang material number:XB-USA-210V2

Product name: USB socket 2.0 Rated current: 1A/3A Rated voltage: 12V/30V Contact resistance: 30M Ω

Insulation resistance: 100M Ω Voltage resistance: 500V AC Service life: 5000 salt spray tests: 24 hours

Working temperature: -40 ° C ± 85 ° C Terminal material: Copper silver plated plastic material: PBT/LCP Product compliance: ROHS


3D file and drawings

3D file Specifications USB2.0

  • Part number information
  • Technical Features
  • Technical Drawings
  • Product Specifications
Product ID Product Image Product Description Product Code Production status Shipping Cycle Gross item weight MPQ MOQ Production in transit Competitive purchases Operation
XB-USA-210V2
     Drawings
XB-USA-210V2
XB-USA-210V2
14.3 * 10 * 15.5mm double-layer vertical USB 2.0 socket/USB 2.0 interface direct insertion/USB 2.0A/F connector/rolled edge USB 2.0 connector 4PIN Normal 4-7 days 0.000 500 2000 10000 No competitors
Product material 1.USB socket for 2.0 material quality
2. Contact terminal yellow metal
3. Metal shell Brass silver plated
4. Rubber shell shell PBT UL94V-0
Product type features Type of connector: The mother end
direction: right angle
Connector system: Cable to board
Sealable: yes
Connector and terminal are terminated to: printed circuit board
Colour of glue core Black / white
Number of ports: 1
End-connection features Terminal terminal type: Surface mount / plug-in
PCB termination method: Surface mount / insertion
Contact features Terminal rated current (maximum value) (A): 1.5A/3A
machine accessory installation site: Intermediate installation
PCB Installation fixed type: Welding wire / welding plate
Connector installation type: Board installation
service environment Welding temperature (max.): 260°C
preheat temperature 150~200°C
Plug-in period (max.): 1500
Group temperature range: -40°C±85°C
Operation / application Be able to pick up: deny
Circuit application: Power supply and signal
Packaging characteristics Packaging method (patch SMD): Roll / package
Packaging method (plug-in DIP): Plastic suction / packaging
Welding experiment Dip the terminal foot in the flux for 5 seconds, then immerse the terminal foot in a 245 ± 5℃ tin furnace for 3 ± 0.5 seconds The tin attached area shall exceed 95% of the immersion surface area
Reflow welding and wave crest welding experiments wave-soldering The recommended solder temperature is 260℃ (500°F) for a maximum of 5 seconds
Hand welding The 30W flipping iron is used to control the temperature at 350℃, and the welding time is about 5 seconds
Back furnace welding The maximum temperature of SMT backwelding furnace is 260℃ and the temperature is 260℃, the maximum time shall not exceed 10 seconds

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Mission: To provide switch connector design solutions for global users and design industry-leading solutions in the shortest possible time.

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