Product ID | Product Image | Product Description | Product Code | Production status | Shipping Cycle | Gross item weight | MPQ | MOQ | Production in transit | Competitive purchases | Operation |
XB-CSM-30621D02-LF ![]() ![]() |
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NANO card slot SMI/SIM card slot/CARD card slot/NANO SIM card slot connector/NANO SIM socket/MIRCO card slot SIM | SIM card holder/SIM connector | Normal | 1-2 weeks | 0.42g | 1000 PCS/disk | 30000 PCS/box | 10000 | No competitors |
product material | 1.Sim card holder/SIM connector | Material | ||
2.Plastic | LCP/PA/UL94V-0 | |||
3. High temperature resistant materials | LCP/PA/UL94V-0 | |||
4.Terminal | copper alloy | |||
5. Shell | SUS | |||
Electrical properties | Rated current | 0.5A DC | ||
Rated voltage | 5.5 DC | |||
Insertion and extraction force | 0.3N-0.9N | |||
Withstand voltage | 250VAC | |||
Insulation resistance | 100MΩ | |||
Contact resistance (initial/after life) | 30MΩ | |||
Durability | No load life | 5000 times | ||
Load life (maximum rated load) | 5000 times | |||
Environmental resistance | Cold resistance | -40±2℃ for 48h | ||
Heat resistance | 85±2℃ for 48h | |||
Moisture resistance | 40±2℃, 90 to 95%RH for 48h | |||
Weldability | Immerse the soldering terminals into velvet tin at 235°C for 3±0.5s with a minimum immersion depth of 2mm. | More than 95% of the surface of the tin-immersed part must be well dipped in tin | ||
Resistant to reflow heat | Preheating: 150°C~200°C 60~120s Heating 217°C 60s Heating peak 260°CMAX: 5s~10s | The appearance should be free of damage, the terminals should not be loose, and the plastic should not be deformed. | ||