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XB-MRUSB-5B-D3
  • XB-MRUSB-5B-D3
  • XB-MRUSB-5B-D3
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  • XB-MRUSB-5B-D3
  • XB-MRUSB-5B-D3

3D file Specifications Micro 规格书通用-1
DrawingsXB-MRUSB-5B-D3

Xibang material number:XB-MRUSB-5B-D3

Product name: MICRO USB Rated current: 1A Rated voltage: 12V/30V Contact resistance: 30M Ω

Insulation resistance: 100M Ω Voltage resistance: 100V AC Service life: 5000 salt spray tests: 24 hours

Working temperature: -40 ° C ± 85 ° C Terminal material: Copper silver plated plastic material: PBT Product compliance: ROHS


3D file and drawings

3D file Specifications Micro 规格书通用-1

  • Part number information
  • Technical Features
  • Technical Drawings
  • Product Specifications
Product ID Product Image Product Description Product Code Production status Shipping Cycle Gross item weight MPQ MOQ Production in transit Competitive purchases Operation
XB-MRUSB-5B-D3
     Drawings
XB-MRUSB-5B-D3
XB-MRUSB-5B-D3
7.2 * 5.06 * 3mm crimped Micro2.0 SMD connector/Micro2.0 USB interface/Micro2.0 socket/Micro2.0 USB socket connector 5PIN
Product material 1.MICRO USB material quality
2. Contact terminal yellow metal
3. Metal shell Brass silver plated
4. Rubber shell shell PBT UL94V-0
Product type features Type of connector: The mother end
direction: right angle
Connector system: Cable to board
Sealable: yes
Connector and terminal are terminated to: printed circuit board
Colour of glue core Black / white
Number of ports: 1
End-connection features Terminal terminal type: Surface mount / plug-in
PCB termination method: Surface mount / insertion
Contact features Terminal rated current (maximum value) (A): 1A 12V AC
machine accessory installation site: Intermediate installation
PCB Installation fixed type: Welding wire / welding plate
Connector installation type: Board installation
service environment Welding temperature (max.): 260°C
preheat temperature 150~200°C
Plug-in period (max.): 1500
Group temperature range: -40°C±85°C
Operation / application Be able to pick up: deny
Circuit application: Power supply and signal
Packaging characteristics Packaging method (patch SMD): Roll / package
Packaging method (plug-in DIP): Plastic suction / packaging
Welding experiment Dip the terminal foot in the flux for 5 seconds, then immerse the terminal foot in a 245 ± 5℃ tin furnace for 3 ± 0.5 seconds The tin attached area shall exceed 95% of the immersion surface area
Reflow welding and wave crest welding experiments wave-soldering The recommended solder temperature is 260℃ (500°F) for a maximum of 5 seconds
Hand welding The 30W flipping iron is used to control the temperature at 350℃, and the welding time is about 5 seconds
Back furnace welding The maximum temperature of SMT backwelding furnace is 260℃ and the temperature is 260℃, the maximum time shall not exceed 10 seconds

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