Product Material | 1. D-SUB connector | Material | ||
2. Shell | UL94V-0 | |||
3. Terminals | Phosphor copper silver plated/Phosphor copper gold plated | |||
3. Plastic shell | Phosphor Bronze | |||
Product Type Features | Rated current | 3A | ||
Rated voltage | 250V AC | |||
Operating temperature range | -55°C±125°C | |||
Contact resistance | 30mΩ | |||
Insulation resistance | 10mΩ | |||
Withstand voltage | 1000V AC | |||
Environmental resistance | Cold resistance | -25±2℃ 96/h | ||
Heat resistance | 105±2℃ 96/h | |||
Moisture resistance | 35±3℃Relative humidity 90~95% 96/h | |||
Mechanical accessories | Installation | Wire/Board Welding | ||
Connector Mounting Type: | Board Installation | |||
Solderability test | Immerse the terminal pins in the flux for 5 seconds, then immerse the terminal pins in a 230±5℃ tin furnace for 5±0.5 seconds | The tin attached area should exceed 95% of the immersed surface area | ||
Solder heat resistance | The terminals should be tested for tin resistance and solder heat resistance under the following conditions and then tested for contact impedance. | |||
Based on: EIA-364-56A | No cracks, scratches or breaks | |||
Solderability temperature: 245°±5C | ||||
Time: 3s+/-0.5s | ||||
Reflow and wave soldering experiments | Wave Soldering | The recommended soldering temperature for DIP type is 260°C (500°F) for a maximum of 5 seconds | ||
Hand welding | Use a 30W soldering iron to control the temperature at 380°C and solder for about 3 seconds | |||
Reflow | The maximum temperature of the SMT reflow oven is 260°C. When the temperature is 260°C, the maximum time does not exceed 10 seconds. | |||
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